发明名称 Wire-guide device for a binding machine
摘要 A binding-wire guide device in a binding machine contains a bend-guide member (4) arranged at the exit (3a) of the straight-guide member (3). The bend-guide member (4) contains a wire-receiving surface (6a) which receives the wire (1) supplied by the straight-guide member (3), in such a way that the wire (1) meets the surface (6a) obliquely. The resulting butting angle of the wire (1) relative to the wire-receiving surface (6a) is variable. Thus, if the front end portion of the wire (1) is curved while it butts against the wire-receiving surface (6a), the following portion of the wire (1) is also curved. In this way, the wire is curved continuously and finally forms a wire loop (p). The bend-guide member (4) has small dimensions, so that a free region at the front end of the binding machine remains. The wire (1) can therefore easily be bound, without butting against any obstacles, around the articles (a) to be bound, thereby altogether improving the operating capacity and output of the binding machine. <IMAGE>
申请公布号 DE4439927(A1) 申请公布日期 1995.05.11
申请号 DE19944439927 申请日期 1994.11.08
申请人 MAX CO. LTD., TOKIO/TOKYO, JP 发明人 MIYAZAKI, ATSUSHI, TOKIO/TOKYO, JP
分类号 B65B27/10;B65B13/18;(IPC1-7):B65B13/04 主分类号 B65B27/10
代理机构 代理人
主权项
地址