Process for producing materials in web or sheet form, in particular circuit-board base material, from glass-fibre/epoxy-resin regrind from circuit-board scrap

摘要

Process for recycling circuit-board scrap, in which the metal-free regrind composed of glass-fibre-reinforced, cured epoxy resin, is mixed with small amounts of virgin, uncured epoxy resin and is pressed on a double-belt press into sheets of circuit-board base material. Alternatively, metal-containing regrind, composed of circuit-board scrap, is mixed with suitable thermoplastic or thermoset materials and pressed into sheets, which are provided with a decorative surface and can be used in the building industry or for vehicle construction and shipbuilding.