RESIN SEAL FORMING MOLD OF SEMICONDUCTOR DEVICE,申请号JP19780018861-传众专利搜索

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发明名称	RESIN SEAL FORMING MOLD OF SEMICONDUCTOR DEVICE
摘要
申请公布号	JPS54111281(A)	申请公布日期	1979.08.31
申请号	JP19780018861	申请日期	1978.02.20
申请人	MITSUBISHI ELECTRIC CORP	发明人	MORITA YUTAKA;YAMAMOTO ISAMU
分类号	H01L23/34;H01L21/56	主分类号	H01L23/34
代理机构		代理人
主权项
地址

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