Method for forming conductive bumps

摘要

A flexible film-like member (13) has conductive metals (3a) filled in tapered holes (12) extending through the thickness and is positioned such that the holes (12) of the member face to respective pad patterns (5) on a circuit board (4). The conductive metals (3a) are then heated and fused so that they are joined and transferred to the pad patterns (5) on the circuit board (4), and the film-like member (13) is then removed by heating or is disolved in cleaning liquid.