发明名称 Inner diameter saw slicing machine
摘要 The open end of the nozzle 42 is positioned close to and facing the surface of the metal base 20 on the side were the portion of the semiconductor ingot is to be cut off. An electromagnetic valve 46 is provided in the passage through which compressed air is supplied to the nozzle 42. The initial position of the blade 19 is detected by the detector 50U and the counter 52 measures the distance the blade 19 travels downward from the detected position and then the comparator 56 detects the point at which the measured value matches the value set on the numeric value setting device 54. The electromagnetic valve 46 is opened to emit compressed air from the nozzle 42 after this detection, until the detection of the lower limit position of the blade 19 by the detector 50D. This compressed air travels along in the direction of the rotation of the metal base 20 to enter the notch of the partially cut portion of the semiconductor ingot 10 made by the inner circumference cutting edge 22 and to consequently blow out the liquid coolant present between the metal base 20 and the semiconductor ingot 10.
申请公布号 US5413521(A) 申请公布日期 1995.05.09
申请号 US19930158856 申请日期 1993.11.29
申请人 SHIN-ETSU HANDOTAI COMPANY, LTD. 发明人 TERASHIMA, SEIICHI;KITA, MASAO
分类号 H01L21/304;B23D59/00;B23D59/02;B28D1/22;B28D5/00;B28D5/02;C30B33/00;(IPC1-7):B24B49/00 主分类号 H01L21/304
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