发明名称 |
Heating furnace in combination with electronic circuit modules |
摘要 |
For use in the fabrication of electronic circuit modules, there is provided a heating furnace which can be arbitrarily set in a desired temperature profile. The furnace includes a plural number of independently controllable heaters located in spaced positions to provide a plural number of heating zones in the furnace, and a plural number of cooling panels provided in the heating zones of the respective heaters. Each heater is independently controlled according to a specified type of substrate to establish a temperature profile for the specified substrate type in the furnace to carry out the curing of a sealing synthetic resin material of a semiconductor device and the reflow soldering of surface mounting devices in one and single furnace.
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申请公布号 |
US5413164(A) |
申请公布日期 |
1995.05.09 |
申请号 |
US19910751944 |
申请日期 |
1991.08.29 |
申请人 |
FUJITSU LIMITED |
发明人 |
TESHIMA, YASUHIRO;NIISHIRO, MAMORU;MATSUBAYASHI, MICHINORI |
分类号 |
F27B9/14;B23K1/008;G05D23/19;H01L21/56;H05K3/28;H05K3/34;(IPC1-7):F25B29/00;B23K37/04;B23K31/02;F27B9/24 |
主分类号 |
F27B9/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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