发明名称 |
Multilayer IC semiconductor package |
摘要 |
An improved multilayer integrated circuit package. The package, which has a plurality of layers of conducting leads, has metal vias which connects leads in a first layer connected to leads in a second layer. The improvement comprises having at least on of the vias with a cross-section such that the via is much larger in a first direction than in a second direction generally perpendicular to the first direction. |
申请公布号 |
US5414222(A) |
申请公布日期 |
1995.05.09 |
申请号 |
US19930108029 |
申请日期 |
1993.08.17 |
申请人 |
LSI LOGIC CORPORATION |
发明人 |
SEN, BIDYUT K.;TOSAYA, ERIC S. |
分类号 |
H01L23/498;(IPC1-7):H05K1/00 |
主分类号 |
H01L23/498 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|