| 摘要 |
An electrically conductive pin and a method of selectively plating an electrically conductive pin. The pin provides gold plated contact regions on two end portions and a center portion plated with another conductive material, which may be tin lead. The method includes selectively masking desired gold plated contact regions with a plating resist material and then plating the center portion with the other conductive material. The plating resist material is preferably an insulator deposited by electrophoresis. The plating resist material is removed, after plating the center portion with the other conductive material, to expose the gold plated contact regions.
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