| 摘要 |
<p>PURPOSE: To minimize the amount of necessary adhesives to be used, by a method wherein the contours of cavities for containing a micromodule unit including a semiconductor chip are formed in a sequence of short arcs, and side faces of the contours of the containing portions for the micromodule unit are slanted at a specific angle and are formed in a sequence of very small conical faces expanding toward the bottom faces of the cavities. CONSTITUTION: A portable object includes zones electrically insulated from one another in a plastic support 2 and has cavities 26, 27 for containing a micromodule unit including a semiconductor chip electrically connected to a semiconductor integrated circuit including at least a storage function. The contours 261, 271 of the cavities 26, 27 have a shape matched to the shape of the semiconductor chip and are formed in a sequence of extremely short arcs as compared with the length on one side of these cavities. Further, side wall faces of the cavities 26, 27 are slanted at an angle of 10 degrees with respect to a dirction perpendicular to the surface of the support 2 and are formed in a sequence of conical faces expanding toward the bottom faces of the cavities.</p> |
