发明名称 RESIN MOLDING AND ITS PRODUCTION
摘要 <p>PURPOSE:To obtain a resin molding having a superior mechanical strength with a reduced production cost and to obtain a production method therefor. CONSTITUTION:A resin molding molded out of a mixture of magnetic tape fine particles obtained by cutting a magnetic tape with a resin material is disclosed. The resin molding is produced by cutting a magnetic tape into scaly magnetic tape fine particles, mixing them with a resin material, and injecting molding the mixture. As the magnetic tape, for example, a waste magnetic tape is used. As the resin material, for example, a reclaimed resin material (a reclaimed plastic produced by reclaiming a foamed polystyrene or the like) is used.</p>
申请公布号 JPH07117053(A) 申请公布日期 1995.05.09
申请号 JP19930268886 申请日期 1993.10.27
申请人 SONY CORP;ITAYA SEISAKUSHO:KK 发明人 SASAKI ITSUKOUSEKI;MAEJIMA EIZO
分类号 B29B17/00;B29B17/04;B29C45/00;B29K105/26;(IPC1-7):B29B17/00 主分类号 B29B17/00
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