发明名称 Semiconductor device and process for fabricating the same
摘要 A semiconductor device comprising a MIS structure comprising a first electrically conductive film formed on an oxide film, a second electrically conductive film formed on at least a part of said first electrically conductive film, an insulator film formed on said second electrically conductive film, and a third electrically conductive film formed on said insulator film; and at least one electrode contact portion formed on said first electrically conductive film. A semiconductor device comprising a MIS capacitor having a diffusion layer inside the semiconductor substrate as a lower electrode with a first electrically conductive type being isolated using another diffusion layer having the opposite conductive type, and said another diffusion layer having the opposite conductive type being further isolated using a diffusion layer for isolation having the first conductive type and which is earthed. A BiCMOS semiconductor device comprising a resistor and an impurity source for the emitter and the emitter electrode for the bipolar transistor made of a same conductor layer, and further, a same conductor layer is provided as the contact electrode for the resistor and the gate for the MOS transistor. Also claimed are processes for fabricating the aforementioned semiconductor devices.
申请公布号 US5414291(A) 申请公布日期 1995.05.09
申请号 US19940189191 申请日期 1994.01.31
申请人 SONY CORPORATION 发明人 MIWA, HIROYUKI;SHINOHARA, MAMORU;GOMI, TAKAYUKI;FUJISAWA, TOMOTAKA
分类号 H01L27/06;(IPC1-7):H01L27/02;H01G4/06 主分类号 H01L27/06
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