| 摘要 |
PURPOSE:To obtain an abrasive material suitable for removing flashes of electronic parts, plastics products, etc., and flat and stain finishing a metal mold surface by heat curing under pressure a heated and molten mixture of a thermosetting resin, an organic filler and an inorganic filler. CONSTITUTION:An abrasive material consists of a thermosetting resin, an organic filler and an inorganic resin and is obtained by heat curing a mixture of these under pressure. A particle size of the abrasive material is 1.0-0.06mm. The material can be obtained by heat mixing and kneading the above-mentioned three components, crushing after cooling and heat melted in a metal mold, then cured, crushed and sieved to a given granular size. 20-60wt.% phenol resin, epoxy resin, etc., as the resin, 20-40wt.% clay, talc, etc., as the inorganic resin and 20-40wt.% woodmeal, ground pulp, etc., as the organic filter are compounded. This abrasive material is specifically suitable for deflashing IC and LSI. |
