| 摘要 |
PURPOSE:To obtain the title compsn. with a high thermal conductivity, low stress properties, and excellent flowability and moldability. CONSTITUTION:The compsn. contains an epoxy resin, a curative, and an inorg. filler which comprises 60-100wt.% alumina particles with an average particle size of 5mum or higher based on whole fillers and 0-40wt.% at least either silica particles with an average particle size of 10mum or lower or spherical crystalline silica particles with an average particle size of 70mum or higher and which has a particle size distribution satisfying that the n-value of the Rosin-Rammler equation in the range of particle sizes of from 1mum to the max. size is 0.60-0.93 and that the coefficient of correlation of regression line is 0.990 or lower. |
