发明名称 Plasma processing apparatus
摘要 In a plasma etching apparatus, a workpiece is mounted on a lower electrode positioned opposite to an upper electrode , a ring-shaped spacer made of a dielectric material is provided on the outer peripheral portion of the lower electrode. When the RF power is supplied between the upper and lower electrodes, the plasma is generated only in a region defined by the upper and lower electrodes surrounded by the dielectric spacer.
申请公布号 US5413673(A) 申请公布日期 1995.05.09
申请号 US19910785256 申请日期 1991.11.04
申请人 ANELVA CORPORATION 发明人 FUJIMOTO, HIDEKI
分类号 H01L21/205;H01J37/32;H01L21/302;H01L21/3065;(IPC1-7):C23F1/02 主分类号 H01L21/205
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