The invention relates to a multilayer substrate for electrical circuits or components, consisting of a multiplicity of ceramic layers and metallisation layers. In order to improve thermal dissipation, a heat sink formed by at least one copper layer is provided on one surface side of the multilayer substrate.
申请公布号
DE4338706(A1)
申请公布日期
1995.05.04
申请号
DE19934338706
申请日期
1993.11.12
申请人
SCHULZ-HARDER, JUERGEN, DR.-ING., 91207 LAUF, DE;MAIER, PETER H., 91207 LAUF, DE
