| 摘要 |
Disclosed is a stencil printing sheet and a process for perforating the same having the advantages in that there is no generation of any perforating failure at a time of stencil-making, any wrinkles, any conveying failure and any printing failure. In a stencil printing sheet constituted by laminating a resin film to a porous substrate, the present invention comprises a process for perforating the stencil printing sheet by using a solvent-soluble resin in the range of 0.1 - 100 mu m in thickness as the above resin film, a stencil printing sheet as described that a solubility of the resin film to a solvent is within 100 seconds in the resin layer of 10 mu m in thickness, a stencil printing sheet as described that a viscosity of a solution dissolving 10 % by weight of the resin in the solvent is 1000 cps or less at 20 DEG C, and a stencil printing sheet constituted by laminating a solvent-soluble resin film to a porous substrate using a solvent, a process for perforating the stencil printing sheet by using a solvent which has a solubility is 100 seconds or less in a resin layer of 10 mu m in thickness and a viscosity of a solution is 1000 cps or less at 20 DEG C. <IMAGE> |
