| 摘要 |
PURPOSE:To suppress the increase in number of external pins by having a miniatured and thin type package. CONSTITUTION:A plurality of pads 2, with which various electric signals are treated, are arranged extending in one direction in the center of the upper surface of a chip 1. The semiconductor chip is sealed by a resin sealing material 10, and a plurality of external leads 7, to be used to transfer a signal, are provided outside the resin sealing material. In the inside of the resin sealing material, a plurality of pads and leads are connected by a plurality of inner leads. Among the pads, the inner leads, corresponding to the pads which treat the same electric signal, are formed detouring the inner leads corresponding to the pads which treat other electric signal, and the inner leads are connected to the pads which treat the same electric signal. |
