| 摘要 |
PURPOSE:To mount a light emitting device side-surface-wise on a mounting board and reduce the thickness of a light emitting unit using the light emitting devices and reduce the number of the parts of the light emitting unit, by providing connecting terminal sections connected electrically with respective electrode patterns in both the corner sections of at least one side surface of a plate-like body. CONSTITUTION:In both the corner sections of one side surface of a board 2 of a chip type LED 1, a connecting terminal section 9 connected electrically with one lead electrode pattern 3 and a connecting terminal section 10 connected electrically with the other lead electrode pattern 4 are provided respectively. The chip type LED 1 is carried to a mounting board 11 in the state wherein its side surface provided with the connecting terminal sections 9, 10 is turned downward, and it is so put on the mounting board 11 that its connecting terminal sections 9, 10 are contacted respectively with connecting terminal sections 12, 13 provided on the mounting board 11 whereto solders are applied previously, and further, it is heated during a fixed time in a thermostat. Thereby, since the chip type LED 1 can be mounted side-surface-wise on the mounting board 11, the number of the parts of a light emitting unit X using the chip type LEDs 1 can be reduced, and concurrently, its thickness can be made smaller than conventional light emitting units. |
