发明名称 |
PRINTED WIRING BOARD AND ITS MANUFACTURE |
摘要 |
PURPOSE:To provide a high reliability printed wiring board which has enhanced the adhesive properties of a prepreg and copper cladding formed by impregnating thermoset on all aromatic polyamide unwoven fabrics. CONSTITUTION:This is a printed wiring board which laminates a prepreg and a copper cladding 5 formed by impregnating thermoset on all aromatic polyamide unwoven fabrics by way of a silane coupling agent layer 6 whose functional group is chemically reacted against and coupled with the functional group of the thermoset. |
申请公布号 |
JPH07115268(A) |
申请公布日期 |
1995.05.02 |
申请号 |
JP19930262170 |
申请日期 |
1993.10.20 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
SOGO HIROSHI;NAKATANI SEIICHI;HATAKEYAMA AKIHITO;KAWAKITA KOJI;OGAWA TATSUO;KOJIMA TAMAKI |
分类号 |
H05K1/11;H05K1/03;H05K1/09;H05K3/38;H05K3/40;H05K3/46;(IPC1-7):H05K3/38 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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