| 摘要 |
The adhesive compsn. for a dicing tape, useful for assembling a semiconductor wafer, is produced by (a) stirring and reacting 22-26 wt.% butyl acrylate, 10.5-11.15 wt.% 2-ethylhexyl acrylate, 4.0-6.6 wt.% methyl methacrylate, 5.36-6.85 wt.% 2-hydroxyethyl methacrylate 4.3-6.52 wt.% vinyl acrylate and 4-12 wt.% benzene in the presence of 0.1 wt.% benzol peroxide as a catalyst for 2 hr to obtain a monomer mixt., (b) dropping the monomer mixt. into 200 kg solvent contg. 38-42 wt.% ethylacetate, and stirring and polymerizing the mixt., and (c) adding 2-hydroxyethyl methacrylate as a curing agent and tricrexyl phosphate to the polymerized reactant, and curing the mixt. at room temp. for 90 min.
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