| 摘要 |
<p>PURPOSE:To rapidly cool a board and stop the board cooling process when the temperature reaches the desired temperature by setting the desired temperature for cooling the board and providing a cooling means to permit the cooling plate temperature lower than the target temperature. CONSTITUTION:The desired board cooling temperature TSW and initial plate temperature TSP are set. When a board is transported on the cooling plate, a Peltier element is driven by a low-temperature cooling means and cooling by the maximum power is started. Cooling continues until the device judges that the board temperature TW has reached the desired cooling temperature TSW. Maximum-power cooling is performed regardless of the output value of a plate temperature sensor unless the cooling plate is cooled to 0 deg.. Since the cooling plate is cooled by the maximum power, cooling plate temperature TP becomes lower than the desired temperature TSW and the initial temperature TSP. When the plate is cooled at high-speed and the board temperature reaches the desired temperature, the board is separated to the position that allows no influence by heat by a cooling control means.</p> |
