| 摘要 |
PURPOSE:To improve the clearness of display mark to be marked on a resin sealed body of resin sealed semiconductor device. CONSTITUTION:In the production method of a resin sealed semiconductor device, by which a display mark 6 is marked on one surface of a resin sealed body 2 added with a die parting agent by laser marking technology, before marking process to mark the display mark 6 on one surface of the resin sealed body by laser marking technology, the surface treatment process is provided to remove the die parting agent on one surface of the resin sealed body 2. |
