| 摘要 |
PURPOSE:To provide a carrier device capable of carrying a matter to be processed between a resist coating developing device and an exposing device mutually, while removing electricity on the matter to be processed. CONSTITUTION:Electric charge stored on a wafer W is led out by earthing an acceptance carrier arm 4, a wafer supporting pin 8 on a wafer acceptance stage 2 and a taking out pin 17 of a buffer wafer cassette 6 which are to make contact with the wafer W in a process for carrying the wafer W which is a matter to be processed between a resist coating developing device 61 and a EB exposing device 62 by an earth lead wire 16. Running of excess current can be prevented and generation of spark can be prevented when the wafer W and the wafer supporting pin 8, and the buffer wafer cassette 6 and the cassette taking out pin 17 are respectively brought in contact with each other by mounting a resistance 7 having resistance value of nearly 10MOMEGA in the middle of the wafer supporting pin 8 and the earth lead wire 16 of the pin 17. |
