发明名称 |
Semiconductor device |
摘要 |
A semiconductor device includes a molded resin encapsulating a semiconductor chip, outer leads extending from the molded resin and having free ends, and a resin layer connecting and supporting the outer leads along the entire length of the outer leads. The resin layer may have an activating ability for soldering. A method for manufacturing a semiconductor device includes preparing a semiconductor device having a molded resin and a plurality of outer lead portions extending from the molded resin and connected to a lead frame, forming a resin film on and between the outer lead portions; cutting the lead portions to provide cantilevered outer leads having free ends; lead-forming the outer leads with lead-forming dies while heating the resin film to form a resin layer connecting and supporting the outer leads along the entire lengths of the outer leads, and taking the semiconductor device out of the lead-forming dies after the resin layer has been cured. |
申请公布号 |
US5412157(A) |
申请公布日期 |
1995.05.02 |
申请号 |
US19930091929 |
申请日期 |
1993.07.16 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
YAGOURA, HIDEYA;HIGUCHI, NORIAKI;SHIMAMOTO, HARUO |
分类号 |
H01L23/50;H01L21/48;H01L23/495;H05K1/18;H05K3/34;(IPC1-7):H01L23/02 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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