Flexible thermal transfer apparatus for cooling electronic components

摘要

A thermal transfer apparatus adapted for thermal connection to a heat source for conducting heat away from the heat source. The thermal transfer apparatus includes a container which is substantially impermeable to fluid and forms an expandable compartment that is substantially gas-free. A thermal transfer liquid is positioned within the expandable compartment for thermal connection to the heat source. The thermal transfer liquid has a boiling point that is at or below an operating temperature of the heat source. When the heat source is in a non-operating state, the thermal transfer liquid is compressed and substantially fills the expandable compartment. When the heat source is in an operating state, the thermal transfer liquid conducts heat from the heat source. The liquid vaporizes and forms a vapor within the expandable compartment which causes the expandable compartment to expand and create a vapor space above the liquid. A condenser condenses the vapor into a condensate at a location remote from the heat source. The condensate then returns to the body of liquid for additional cooling of the heat source.