| 摘要 |
A lead-bend measuring apparatus comprising: an illuminating device for projecting light onto leads projecting from a package of an integrated circuit device; an imaging device for imaging light reflected from and transmitted through the leads; a cutout device for fetching an image of the imaged light and dividing the image into a plurality of sections; a binarization processing device for processing gradations of the image with different binarization levels for each of the divided sections; a profile counter device for preparing profiles of various portions of the leads corresponding to the respective sections from binarized data subjected to processing by the binarization processing device; a calculating device for calculating a deviation of each of the prepared profiles from a reference profile and determining an amount of bend of each of the leads; and a device for determining a non-defective or defective state by making a comparison between the amount of bend calculated and allowable values. The respective sections are processed by corresponding binarization levels to measure the bend of leads, so that clear binarized images are obtained even if the illuminance of the various portions of the leads is not uniform.
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