ELECTRICAL CONTACT AND FORMATION THEREOF

摘要

PURPOSE:To provide a method of bump leveling allowing easy and highly acculate height control of metal bumps formed on the surface of even a large semiconductor wafer. CONSTITUTION:It is not leveling by collectively pushing all metal bumps 2 on a semiconductor wafer 1 but in a limited area, that is every one piece of bumps of metal bumps 2, or every metal bump 2 inside every range to become one or more chips are pushed after dicing by means of a semiconductor wafer 1 so as to control the height of bumps.