| 摘要 |
PURPOSE:To lessen a multilayer wiring structure in number of munufacturing processes, to fill wiring material into a contact hole, and to lessen the contact hole in an aspect ratio at a time. CONSTITUTION:An contact hole 22 of a (n+1)-th wiring layer 24 is filled with a part 23 of the wiring material of an n-th wiring layer 14, and the (n+1)-th wiring layer 24 and the n-th wiring layer 14 are insulated from each other lay an upside insulating film 3 and a side wall insulating film 4 formed on the upside and side face of the n-th wiring layer 14 in a self-aligned manner respectively. |
