发明名称 |
Local condensation control for liquid impingement two-phase cooling |
摘要 |
Cooling module geometry provides a method for controlling local condensation for liquid impingement two-phase cooling of electrical and/or electronic circuit chips. The method and apparatus described herein uses vapor condensation in the exhaust flow from each chip site within a multi-chip module which utilizes direct liquid impingement with phase change.
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申请公布号 |
US5412536(A) |
申请公布日期 |
1995.05.02 |
申请号 |
US19940218534 |
申请日期 |
1994.03.28 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ANDERSON, TIMOTHY M.;CHRYSLER, GREGORY M.;CHU, RICHARD C.;SIMONS, ROBERT E. |
分类号 |
H01L23/427;H05K7/20;(IPC1-7):H05T7/20 |
主分类号 |
H01L23/427 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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