| 摘要 |
The glass composition for adhesion consists of 80-99.5 wt% low melting point glass powder including 70-87 wt% lead oxide, 6-15 wt% boron oxide, 2-14 wt% zinc oxide, 0.1-2.5 wt% silica, 0.1-2.5 wt% alumina, 0.1-3 wt% barium oxide and 0.5-20 wt% low thermal expansive crystallized glass powder as a filler including 45-65 wt% zinc oxide, 15-30 wt% boron oxide, 8-15 wt% silica, 2-8 wt% magnesia. This glass composition has high adhesion strength even though heated at low temperature.
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