PHOTOSENSITIVE RESIN COMPOSITIONS

摘要

The three component photosensitive resin compsn. used in the formation of a micropattern for the mfr of semiconductor devices is composed of 100 wt. pts. of an alkali-soluble resin i.e. novolac resin contg. an aromatic ring, 5˜40 wt. pts. of a phosphagen cpd. of formula (I) [R=-COO(CCH3)3; x=3 or 4 protected with a t-butoxy carbonyl (t-BOC) gp. as a disslution inhibitor, and 1˜20 wt. pts. of an onium salt of formula ArnX+Y- [Ar=aromatic hydrocarbon gp.; n=1˜3; X=halogen or S; Y=BF4, PF6, AsF6, SbF6, CF3 or SO3 , an organic sulfonic ester or a pyrogallol sulfonic ester cpd. as a photoacid generator.