发明名称 |
Process for producing metal-polyimide composite article. |
摘要 |
<p>The present invention provides a process for producing a metal (2)-polyimide (3) composite material such as a wiring board. In production thereof, deterioration of polyamide film (3) due to oxidation during imidization of a polyimide precursor in contact with metal (2) such as copper or silver can be prevented. The present invention is characterized by using a polyimide precursor having an acidic functional group which is masked. Examples of the polyamide precursor are polyamic acid epoxy adducts, amido polyamic acids, silylated polyamic acids, etc.</p> |
申请公布号 |
EP0361461(B1) |
申请公布日期 |
1995.04.26 |
申请号 |
EP19890117907 |
申请日期 |
1989.09.28 |
申请人 |
HITACHI, LTD. |
发明人 |
NUMATA, SHUNICHI;MIWA, TAKAO;IKEDA, TAKAYOSHI;FUJISAKI, KOJI;SHIMANOKI, HISAE;MIYAZAKI, KUNIO;MIURA, OSAMU;WATANABE, RYUJI;MIYAMOTO, TOSHIO;OKOSHI, YUKIO |
分类号 |
B32B15/088;B32B15/08;C08G73/10;H01B1/22;H01B3/30;H01L21/48;H01L23/14;H05K1/03;(IPC1-7):H05K1/03;B01F3/20;C08L79/08 |
主分类号 |
B32B15/088 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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