| 摘要 |
A solid-state image device and a method of manufacturing are disclosed. The solid-state image device has: a plurality of pixels, each pixel having a transistor for converting an incident light into an electrical signal, the transistor having a semiconductor substrate, source-drain regions formed on a surface portion of the semiconductor substrate, the source-drain regions being spaced apart from each other to define a channel region between them, and a gate electrode formed above the channel region; a selection line electrically connected to the gate electrode for selecting a pixel from the plurality of pixels; an interlayer insulating film formed to cover the gate electrode and the source and drain regions; a signal line connected to one of the source-drain regions through a contact hole formed in the interlayer insulating film; and a light-shielding film formed below the interlayer insulating film to cover the source-drain region connected to the signal line. <IMAGE> |
