Resist coated metal- or semiconductor-substrate having a stable resist-substrate adhesion.

摘要

2.1 The manufacture of moulds for micromechanical structures using X-ray depth lithography requires metal or semiconductor substrates to be available which have a firmly adhering resist coating. 2.2 Before being coated with the resist, the substrate intended to be coated with the resist is first treated in a solution of a linear organic compound which is capable of self-assembly and has two terminal functional groups. In this way, a monomolecular layer of molecules which serves as adhesion-promoting layer as a result of the bonding both to the substrate and to the resist is obtained between substrate and resist. 2.3 Resist-coated substrates for X-ray depth lithography and their manufacture.