FITTING UNIT FOR MULTILAYER HYBRID CIRCUIT WITH POWER COMPONENTS.

摘要

PCT No. PCT/DE93/00548 Sec. 371 Date Dec. 9, 1994 Sec. 102(e) Date Dec. 9, 1994 PCT Filed Jun. 24, 1993 PCT Pub. No. WO94/01889 PCT Pub. Date Jan. 20, 1994A mounting unit for a multilayer hybrid circuit having power components provides improved heat dissipation from the power components. The mounting unit includes a thermally conductive substrate board on which the multilayer hybrid circuit is mounted, the substrate board including a ceramic board that is coated with copper film.