| 摘要 |
<p>The invention provides for increased IC density on circuit boards having at least one IC mounted on each side of a two sided PC or SMT board by utilizing one or more IC's having pin assignments arranged as a mirror image of each other along a centerline through the IC package in the X or Y axis, such that one or more IC's having the same set of mirror image pin assignments mounted on each side of a circuit board and rotated 180 degrees in relationship to each other will ensure that the pin assignments of the same type will be directly opposite each other and separated by the circuit board.</p> |
