发明名称 Plasma etch reactors and methods of operating thereof.
摘要 The disclosure relates to a method of operating a plasma etch ractor, consisting of introducing a gas into the reactor (10) which disassociates as a plasma into an etch species which etches oxide films on a work piece in the reactor and a non-etching species combinable with the etch species into an etch-preventing polymer condensable onto the work piece below a characteristic deposition temperature, providing an interior wall (20) comprising a material which scavenges the etching species, and maintaining a temperature of the interior wall above the deposition temperature. <IMAGE>
申请公布号 EP0650182(A1) 申请公布日期 1995.04.26
申请号 EP19940307307 申请日期 1994.10.05
申请人 APPLIED MATERIALS, INC. 发明人 RICE, MICHAEL;MARKS, JEFFREY;GROECHEL, DAVID W.;BRIGHT, NICOLAS J.
分类号 C23F4/00;B44C1/22;H01J37/32;H01L21/302;H01L21/3065 主分类号 C23F4/00
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