发明名称 SEMICONDUCTOR CHIP AND INTEGRATED CIRCUIT DEVICE USING SAID SEMICONDUCTOR CHIP
摘要 <p>PURPOSE:To prevent contact damages and surface roughening of a bonding pad surface due to the contact of a probe needle. CONSTITUTION:A probe pad 6, to which a probe needle for probe inspection comes into contact and which is electrically connected to a bonding pad 4, is formed separately from the bonding pad 4. By doing this, a probe test can be performed by bringing the probe needle into contact with the probe pad 6, so that the bonding pad 4 will not contact the probe needle, thereby preventing the roughening of the surface of the bonding pad 4 and contact damages.</p>
申请公布号 JPH07111282(A) 申请公布日期 1995.04.25
申请号 JP19930255545 申请日期 1993.10.13
申请人 HITACHI LTD;HITACHI MICOM SYST:KK 发明人 SAITOU REIJI
分类号 H01L21/66;H01L21/60;(IPC1-7):H01L21/66 主分类号 H01L21/66
代理机构 代理人
主权项
地址