发明名称 |
High density semiconductor device having inclined chip mounting |
摘要 |
A semiconductor device having a rectangular COB substrate body, a die pad on the surface of the substrate body, a plurality of outer leads at the periphery of the substrate body, a plurality of wiring patterns on the surface of the substrate body connected to corresponding outer leads, a plurality of inner leads on the surface of the substrate body surrounding the die pad, connected to corresponding outer leads by the corresponding wiring patterns, and arranged in a substantially rectangular shape having sides, each respectively forming a predetermined acute angle with respect to a corresponding side of the substrate body whereby intervals between adjacent wiring patterns are longer than a predetermined length, a semiconductor chip having a plurality of electrode pads and mounted on the die pad, and a plurality of wires establishing electrical connections between the plurality of electrode pads of the semiconductor chip and corresponding inner leads.
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申请公布号 |
US5410182(A) |
申请公布日期 |
1995.04.25 |
申请号 |
US19930079737 |
申请日期 |
1993.06.22 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
KURAFUCHI, KAZUHIKO;OCHI, KATSUNORI;ISHIMARU, YOSHIYUKI;KIMURA, KENJI |
分类号 |
H01L23/12;H01L23/13;H01L23/498;H01L23/50;H01L23/538;(IPC1-7):H01L23/48;H01L29/44;H01L29/52;H01L29/60 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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