| 摘要 |
<p>PURPOSE:To prevent the increase in size and the increase of defective appearance of a package caused by the increase in number of outer leads. CONSTITUTION:For example, an outer lead 13, to be taken out from the lower surface of the ceramic substrate 12 where a semiconductor chip 11 is mounted, is concentrically formed on conductors 13a and 13b through the intermediary of an insulator 13c. One conductor 13a of the outer lead 13 is connected to the lead terminal 15a of an inner lead 15 where the electrode pad 11 of the semiconductor chip 11 is connected, and other conductor 13b is connected to another lead terminal 15b respectively. Thus, the conductors 13a and 13b are formed in an electrically independent coaxial structure by the insulator 13c, and as a result, signals larger in number than the outer lead 13 can be handled by the use of this constitution.</p> |
