| 摘要 |
<p>PURPOSE:To obtain a resist ink composition usable for a permanent protective film, such as a soldering resist, a plating resist, or an interlaminar insulating material in the build-up technique, in the electronic material field where good heat resistance, chemical resistance, electrical insulating properties, etc., are required. CONSTITUTION:This resist ink composition for a permanent protective film consists of a compound having at least two radical-polymerizable groups and at least two amino groups in the molecule and curable by actinic radiation, a photopolymerization initiator, and a reactive and/or nonreactive diluent as the essential components, and which can be developed by an aqueous solution of an acid.</p> |
