发明名称 |
Microelectronic package comprising tin-copper solder bump interconnections, and method for forming same |
摘要 |
A microelectronic package comprises an integrated circuit component mounted on a substrate by solder bump interconnections formed of a lead-free, tin-base solder alloy that contains a significant copper addition. A preferred solder is composed of a tin alloy containing between about 2 and 8 weight percent copper, preferably between about 3 and 5 weight percent. In the absence of lead, it is found that precipitation of copper-containing intermetallics of the type that adversely affect tin-lead solders is reduced. Moreover, the lead-free copper-tin solder alloy exhibits a high surface tension to reduce collapse of component toward the substrate during solder reflow.
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申请公布号 |
US5410184(A) |
申请公布日期 |
1995.04.25 |
申请号 |
US19930130830 |
申请日期 |
1993.10.04 |
申请人 |
MOTOROLA |
发明人 |
MELTON, CYNTHIA;BAKER, THERESA L. |
分类号 |
H01L21/60;H01L23/485;H05K3/34;(IPC1-7):H01R23/48 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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