发明名称 |
GROUNDING MATERIAL AT CABLE JOINT |
摘要 |
<p>PURPOSE:To facilitate grounding at a cable joint by providing a layer of low temperature solder for a ground wire lead-out metal being wound around a copper shield tape and then heating the solder at low temperature from the outside. CONSTITUTION:In a cable join of a CV cable, for example, a ground wire lead-out metal 20 is wound around the cable at a part where a copper shield tape 4 is exposed and a solder provided integrally on the surface of the metal 20 contacting the copper shield tape 4 is then fused thus bonding them. The low temperature solder provided on the inner face of the plate body is composed of a material fusible at 100-120 deg.C so that the soldering work can be performed by heating at a low temperature from the outside of the ground wire lead-out metal. A flexible member, e.g. a ribbon heater member 40, as well as an arcuate heating member can be employed as a heating member for the ground wire lead-out metal 20.</p> |
申请公布号 |
JPH07111723(A) |
申请公布日期 |
1995.04.25 |
申请号 |
JP19930276132 |
申请日期 |
1993.10.07 |
申请人 |
MITSUBISHI ELECTRIC CORP;MITSUBISHI CABLE IND LTD |
发明人 |
KOSAKA TAKEHARU;OKUMURA YASUSHI;UEDA TOMOKIYO;SAKASEGAWA KATSUMI;DORO YUUJIROU |
分类号 |
H01R4/64;H01R4/02;H02G15/00;(IPC1-7):H02G15/00 |
主分类号 |
H01R4/64 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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