Aluminum nitride sintered body, method for manufacturing the same, and ceramic circuit board

摘要

Disclosed is an aluminum nitride sintered body which has a high thermal conductivity and a high strength and which can be manufactured through low-temperature, short-time sintering. This aluminum nitride sintered body has an average grain size of aluminum nitride grains of 2 mu m or less, a thermal conductivity of 80 W/m.K or more, and a relative density of 98% or more.