发明名称 LEAD FRAME AND MANUFACTURE THEREOF
摘要 PURPOSE:To prevent an electric short circuit generating between leads and to secure sufficient bonding area by a method wherein the coining surface, formed by coining the tip part of an inner lead, is formed almost in the same width from the base side to the tip part. CONSTITUTION:The tip of inner leads 5 is flattened by a coining punch 10, and in this case, the surface of the coining punch 10 is formed in sloping surface which is making a gradual downgrade toward the tip of the inner leads 5, and a coining operation is conducted. The grade angle of the punch surface of the coining punch 10 is set almost in the same grade as the tip part of the inner leads 5, and a staking work is conducted as far as to the tip of the inner leads 5. The entire coining part 8 can be staked almost uniformly without making the coining depth so much. Thus, the coining part 8 can be subjected to coining almost in the same width from the base part to the tips side, and the intervals between leads can be maintained almost uniformly.
申请公布号 JPH07111308(A) 申请公布日期 1995.04.25
申请号 JP19930254085 申请日期 1993.10.12
申请人 APIC YAMADA KK 发明人 NAKANE HIROICHI;MIYAZAWA KYUZO
分类号 H01L23/50;(IPC1-7):H01L23/50 主分类号 H01L23/50
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