发明名称 Method of producing a semiconductor device by forming contacts after flowing a glass layer
摘要 A method of producing a semiconductor device comprising a bipolar transistor and a MOSFET (e.g., a Bi-MOS device), comprising the steps of: forming an insulating layer on an epitaxial silicon layer on a semiconductor substrate; forming a gate electrode; forming a base region; forming a PSG (an impurity containing glass) layer on the whole surface; carrying out a heat-treatment on the PSG to cause a softening and flow thereof (sloping ends of and flattening the PSG layer); opening collector, emitter, source and drain contact windows in the PSG layer and the insulating layer; forming a doped polysilicon layer over the contact windows with the formation of an emitter region; opening a base contact window; and forming metal (Al) electrodes.
申请公布号 US5409843(A) 申请公布日期 1995.04.25
申请号 US19920933584 申请日期 1992.08.24
申请人 FUJITSU, LTD. 发明人 YAMAUCHI, TUNENORI;WAKUI, YOJI
分类号 H01L29/73;H01L21/28;H01L21/3105;H01L21/331;H01L21/60;H01L21/8249;H01L29/732;(IPC1-7):H01L21/265;H01L29/70 主分类号 H01L29/73
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