LEAD FRAME AND SEMICONDUCTOR DEVICE USING LEAD FRAME AS WELL AS MANUFACTURE OF SEMICONDUCTOR DEVICE

摘要

PURPOSE:To manufacture a semiconductor device whose moisture-proofness is good by effectively preventing the deformation of a lead-frame suspension pin, the disconnection of a wire and the like. CONSTITUTION:A lead frame 1 is provided with lead frame beams 2, with a die pad 4 installed inside the lead frame beams 2, with suspension pins 3 which connect the die pad 4 to the lead frame beams 2 and with leads 5 installed so as to protrude inside the lead frame beams 2. The suspension pins 3 are molded in such a way that their cross-sectional shape in the width direction is nearly V-shaped.