HEAT TREATMENT EQUIPMENT

摘要

PURPOSE:To provide a heat treatment equipment which can improve film formation uniformity in the orientation flat part of a semiconductor wafer. CONSTITUTION:In a heat treatment equipment, a boat cover 20 is formed so as to cover a plurality of semiconductor wafers 10 which are accommodated in a boat and whose orientation flat parts are orderly arranged. A flat plate part 25 is formed on the inner wall surface of the boat cover which surface faces the orientation flat part row of the semiconductor wafers 10.