| 摘要 |
PURPOSE:To provide conductive paste where diffusion of Ag into a substrate and reaction with the substrate can be restrained, and provide a low temperature baking ceramic wiring board without delamination, blister or the like by mixing Ag, BaO and a glass component in a specific ratio, and dispersing the resultant mixture in an organic vehicle. CONSTITUTION:A mixture composed of 99-85wt.% of Ag or a metal component including at least one kind of Pd, Pt and Au in Ag and 1-15wt.% of BaO is mixed with 0-10wt.% in an outer ratio of a glass component and an adequate quantity of an organic vehicle, thus preparing conductive paste. An inside wiring is formed of the resultant conductive paste, thereby providing a low temperature baking ceramic wiring board. |
