MULTICHIP MODULE, ITS MANUFACTURE, AND MOUNTING METHOD ONTO PRINTED-WIRING BOARD

摘要

PURPOSE:To provide a multichip module which can be mounted at high density and which can be mounted on a printed-wiring board even when the board is warped. CONSTITUTION:A wiring layer 22 composed of two layers is formed on an insulating substrate 21, and a dummy wiring layer 23 composed of two layers in the same manner is formed on the back of the insulating substrate 21. On the surface of the wiring layer 22, a plurality of semiconductor elements 24 are connected respectively to prescribed wiring patterns by wires 25. The outermost layer on the back side is provided with protrusion parts 27 formed of an insulating resin, and electrode parts 26 which are brought into continuity to internal wiring layers by through holes 28 and which are composed of a metal layer are formed on the surface of the protrusion parts 27.